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E2D0039-39-21
Semiconductor MSM6596A-xxx
Semiconductor 2-Mbit Serial Voice ROM
This version: Feb. 1999 MSM6596A-xxx Previous version: May. 1997
GENERAL DESCRIPTION
The MSM6596A is the shorter-TAT processing version of the MSM6596. The MSM6596A is a serial voice ROM with a 1,048,576-word 1-bit 2-bank configuration. The MSM6596A has a built-in internal address-generating circuit. A single, external clock input allows continuous, serial read operations. The internal addresses are automatically incremented by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed by inputting external serial addresses. Banks are switched with CS1 and CS2. A read and playback device with predetermined messages can easily be configured by storing the voice data into the MSM6596A and combining it with one of OKI's recording and playback ICs and serial register IC. A serial register is required to drive the MSM6596A by the MSM6388 or MSM6588. (The MSM6596A does not operate without a serial register.) The major functional differences between the MSM6596A and MSM6596 are shown below. MSM6596A DC Characteristics
Parameter Current consumption (1) Symbol IDD Condition tRDC = 2.5 ms CS1 = CS2 = VDD - 0.2 V Ta = -40 to +70C Ta = -40 to +85C VDD = 2.7 to 5.5 V, Ta = -40 to +85C Min. -- -- -- Typ. 9 -- -- Max. 20 10 mA 50 Unit mA
Current consumption (2)
IDS
Typical values are at VDD = 5.0 V, Ta = 25C.
MSM6596 DC Characteristics
Parameter Current consumption (1) Current consumption (2) Symbol IDD IDS Condition tRDC = 2.5 ms CS1 = CS2 = VDD-0.2 V
VDD = 3.5 to 5.5 V, Ta = -40 to +85C Min. -- -- Typ. -- -- Max. 15 10 Unit mA mA
Typical values are at VDD = 5.0 V, Ta = 25C.
For other details, refer to individual sections in this data sheet.
FEATURES
* Configuration : * Serial access : * Shorter-TAT processing * Power-supply voltage : * Package options : 18-pin plastic QFJ (QFJ18-P-R290-1.27) 24-pin plastic SOP (SOP24-P-430-1.27-K) 18-pin plastic DIP (DIP18-P-300-2.54) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) 1,048,576 words 1 bit 2 banks Read cycle time of 2.5 ms 2.7 to 5.5 V (Product name : MSM6596A-xxxJS) (Product name : MSM6596A-xxxGS-K) (Product name : MSM6596A-xxxRS) (Product name : MSM6596A-xxxGS-AK) 1/12
Semiconductor
MSM6596A-xxx
BLOCK DIAGRAM
SADX
X-ADDRESS COUNTER X-DECODER
Sin
X-ADDRESS REGISTER
10 1 1
10
Memory Cell Matrix 262144 8 VDD GND
SASX SADY
CK
LD CK
Y-DECODER
Sin
Y-ADDRESS COUNTER Y-ADDRESS REGISTER
MULTIPLEXER
10
6 3
TEST TESTO1 TESTO2
MULTIPLEXER
SASY TAS RDCK CS2 CS1
CK
LD CK
DOUT
CS CONTROL
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Semiconductor
MSM6596A-xxx
PIN CONFIGURATIONS (TOP VIEW)
DOUT SADY SASY GND
2
1 18 17
CS2 CS1 NC SADX SASX
3 4 5 6 7
16 15 14 13 12
TESTO1 NC NC RDCK NC
8
TAS
9 10 11
VDD TESTO2 TEST
SADY SASY CS2 CS1 NC NC NC NC SADX SASX TAS VDD
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
GND NC DOUT TESTO1 NC NC NC NC NC RDCK TESTO2 TEST
NC: No connection 18-Pin Plastic QFJ
NC: No connection 24-Pin Plastic SOP
SADY 1 SASY 2 CS2 3 CS1 4 NC 5 SADX 6 SASX 7 TAS 8 VDD 9
18 GND 17 DOUT 16 TESTO1 15 NC 14 NC 13 RDCK 12 NC 11 TESTO2 10 TEST
SADY SASY CS2 NC CS1 NC NC NC NC NC NC SADX SASX TAS VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 NC: No connection
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
GND NC DOUT TESTO1 NC NC NC NC NC NC NC NC RDCK TESTO2 TEST
NC: No connection 18-Pin Plastic DIP 30-Pin Plastic SSOP
3/12
Semiconductor
MSM6596A-xxx
PIN DESCRIPTIONS
Pin QFJ SOP DIP SSOP 9 18 6 12 24 9 9 18 6 15 30 12
Symbol Type
Description Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. Ground pin (SERIAL ADDRESS) This pin inputs the starting X address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AX0 - AX9) serial data via the SADX pin. (SERIAL ADDRESS) This pin inputs the starting Y address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AY0 - AY9) serial data via the SADY pin. (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the X address into the device's internal register. (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the Y address into the device's internal register. (TRANSFER ADDRESS STROBE) This is the input pin for loading the serial address data into the internal address counter. The X and Y addresses are stored at the falling edge of TAS. (READ CLOCK) This is the clock input pin for reading information out of the data register. Internal operation starts at the falling edge of RDCK. The information in the data register is output on the DOUT pin. The internal address counter is automatically incremented at the falling edge of RDCK. (DATA OUT) The data output pin is always kept in a high-impedance state when RDCK or CS is kept "H". This pin reflects the "H" or "L" level data being read, and the current data is hold until ROCK is asserted "H". (CHIP SELECT) When CS1 is set to "L", bank 1 is selected. When CS2 is set to "L", bank 2 is selected. Setting both CS1 and CS2 to "H" disables all input and output pins. These pins enable parallel use of multiple serial voice ROMs by connecting the data output pins. Pin for testing. Apply a "L" level. Pins for testing. Leave these pins open.
VDD GND SADX
-- -- I
1
1
1
1
SADY
I
7 2
10 2
7 2
13 2
SASX SASY
I I
8
11
8
14
TAS
I
13
15
13
18 RDCK
I
17
22
17
28 DOUT CS1
O
4 3 10 16 11
4 3 13 21 14
4 3 10 16 11
5 3 16
I CS2 TEST I O
27 TESTO1 17 TESTO2
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25C Ta = 25C -- Rating -0.3 to +7.0 -0.3 to VDD+0.3 -55 to +150 Unit V V C
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Semiconductor
MSM6596A-xxx
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Symbol VDD Top Condition GND=0 V -- Range 2.7 to 5.5 -40 to +85 Unit V C
ELECTRICAL CHARACTERISTICS
DC Characteristics
VDD = 2.7 to 5.5 V, Ta = -40 to +85C Parameter "H" Level Input Voltage "L" Level Input Voltage "H" Level Output Voltage "L" Level Output Voltage "H" Level Input Current "L" Level Input Current Current Consumption (1) Symbol VIH VIL VOH VOL IIH IIL IDD Condition -- -- IOH = -40 mA IOL = 2 mA VIH = VDD VIL = GND tRDC = 2.5 ms CS1 = CS2 = VDD - 0.2 V Ta = -40 to +70C Ta = -40 to +85C Min. 0.85xVDD -- VDD-0.3 -- -- -10 -- -- -- Typ. -- -- -- -- -- -- 9 -- -- Max. -- 0.15xVDD -- 0.45 10 -- 20 10 mA 50 Unit V V V V mA mA mA
Current Consumption (2)
IDS
Typical values are at VDD = 5.0 V, Ta = 25C.
AC Characteristics
VDD = 2.7 to 5.5 V, Ta = -40 to +85C Parameter CS, SAS Setup Time SASX, SASY Cycle Time SASX, SASY Precharge Time SASX, SASY Pulse Width Address Setup Time Address Hold Time TAS Setup Time TAS, RDCK Setup Time TAS Pulse Width Read Cycle Time Access Time Output Turn-off Delay Time RDCK Precharge Time RDCK Pulse Width Symbol tCSS tSSC tSAP tSAS tAS tAH tATS tTRS tTAS tRDC tACC tOFF tRDP tRD Min. 1000 500 250 250 100 100 500 500 250 2500 -- 0 1000 1500 Max. -- -- -- -- -- -- -- -- -- -- 1500 200 -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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Serial Address Input Timing
TIMING DIAGRAMS
Semiconductor
, , ,, , ,
CS1 (I) CS2 (I) SADX (I) AX0 AX1 AX2 AX3 tAH tAS SASX (I) tSAS tSAP tCSS tSSC SADY (I) AY0 tAH AY1 AY2 AY3 tAS SASY (I) tSAS tSAP tCSS tSSC TAS (I)
, , ,,
AX9 tATS AY9 tATS tTAS
AX4
AX5
AX6
AX7
AX8
AY4
AY5
AY6
AY7
AY8
MSM6596A-xxx
6/12
Read Access Timing
Semiconductor
TAS (I)
RDCK (I)
DOUT (O)
,,
tTAS tTRS tRDC tRD tRDP tOFF XnYm XnYm+1 XnYm+2 XnY1023 Xn+1Y0 Xn+1Y1 tACC
MSM6596A-xxx
7/12
Semiconductor
MSM6596A-xxx
APPLICATION CIRCUIT
MSM6588 Playback Storage Example
DVDD DVDD' AVDD
MICROCONTROLLER
VDD SAD SAS TAS RWCK WE DIN DOUT AU/D TEST TEST TEST TEST TEST CS CS1 CS2 CS3 CS4
VDD SADX SASX TAS RDCK DOUT SASY SADY
VDD
2-Mbit SERIAL VOICE ROM MSM6596A-xxx
MSM6588
MCUM TEST RSEL1 RSEL2 TEST TEST TEST TEST RESET
MSM6389
RD WR CE
1-Mbit SERIAL REGISTER MSM6389
D3 D2 D1 D0
SAD SAS TAS RWCK WE DI/O
GND
CS
GND
TEST CS1 CS2 GND
+
MIN MOUT LIN
MON XT XT
4.096 MHz
DGND AOUT Speaker amplifier
AVDD +
+
LOUT AMON FIN FOUT ADIN SG DGND
AGND
AGND
Note: When the MSM6596A is driven by the MSM6388 or MSM6588, a serial register is required. (The MSM6596A does not operate without it.) The MSM6389 is being used as the serial register in the above example.
8/12
Semiconductor
MSM6596A-xxx
PACKAGE DIMENSIONS
(Unit : mm)
QFJ18-P-R290-1.27
Spherical surface
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.50 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
9/12
Semiconductor
MSM6596A-xxx
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
10/12
Semiconductor
MSM6596A-xxx
(Unit : mm)
DIP18-P-300-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.30 TYP.
11/12
Semiconductor
MSM6596A-xxx
(Unit : mm)
SSOP30-P-56-0.65-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.19 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
12/12
E2Y0002-29-11
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan

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